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| No. | Article |
|---|---|
| 1 |
Investigation of optical properties of benzocyclobutene wafer bonding layer used for 3D interconnects via infrared spectroscopic ellipsometry Kamineni VK, Singh P, Kong LW, Hudnall J, Qureshi J, Taylor C, Rudack A, Arkalgud S, Diebold AC Thin Solid Films, 519(9), 2924, 2011 |