검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Adhesion between Ni/Fe lead frame and epoxy molding compounds in IC packages Asai SI, Ando T, Tobita M Journal of Adhesion Science and Technology, 10(1), 1, 1996 |
| 2 |
Development of an Anisotropic Conductive Adhesive Film (Acaf) from Epoxy-Resins Asai SI, Saruta U, Tobita M, Takano M, Miyashita Y Journal of Applied Polymer Science, 56(7), 769, 1995 |