검색결과 : 6건
| No. | Article |
|---|---|
| 1 |
Detailed investigation of ultrasonic Al-Cu wire-bonds: I. Intermetallic formation in the as-bonded state Drozdov M, Gur G, Atzmon Z, Kaplan WD Journal of Materials Science, 43(18), 6029, 2008 |
| 2 |
Detailed investigation of ultrasonic Al-Cu wire-bonds: II. Microstructural evolution during annealing Drozdov M, Gur G, Atzmon Z, Kaplan WD Journal of Materials Science, 43(18), 6038, 2008 |
| 3 |
TEM microstructural analysis of As-bonded Al-Au wire-bonds Karpel A, Gur G, Atzmon Z, Kaplan WD Journal of Materials Science, 42(7), 2334, 2007 |
| 4 |
Microstructural evolution of gold-aluminum wire-bonds Karpel A, Gur G, Atzmon Z, Kaplan WD Journal of Materials Science, 42(7), 2347, 2007 |
| 5 |
Strain-Measurements of Sigec Heteroepitaxial Layers on Si(001) Using Ion-Beam Analysis Sego S, Culbertson RJ, Smith DJ, Atzmon Z, Bair AE Journal of Vacuum Science & Technology A, 14(2), 441, 1996 |
| 6 |
Heteroepitaxial Si1-X-Ygexcy Films on (100)Si Substrates for Future Low-Power Applications Alford TL, Bair AE, Atzmon Z, Stout LM, Balster SG, Schroder DK, Roedel RJ Thin Solid Films, 270(1-2), 632, 1995 |