| 1 |
Improved mechanical and thermal properties of spent coffee bean particulate reinforced poly(propylene carbonate) composites
Kumar TSM, Rajini N, Tian HF, Rajulu AV, Ayrilmis N, Siengchin S
Particulate Science and Technology, 37(5), 639, 2019 |
| 2 |
Mechanical and thermal properties of spent coffee bean filler/poly(3-hydroxybutyrate-co-3-hydroxyvalerate) biocomposites: Effect of recycling
Kumar TSM, Yorseng K, Rajini N, Siengchin S, Ayrilmis N, Rajulu AV
Process Safety and Environmental Protection, 124, 187, 2019 |
| 3 |
Adhesive characteristics and bonding performance of phenol formaldehyde modified with phenol-rich fraction of crude bio-oil
Aslan M, Ozbay G, Ayrilmis N
Journal of Adhesion Science and Technology, 29(24), 2679, 2015 |
| 4 |
Effect of outdoor storage conditions of wood chip pile on the technological properties of wood-based panel
Ergul E, Ayrilmis N
Biomass & Bioenergy, 61, 66, 2014 |
| 5 |
Comparison of passive house construction types using analytic hierarchy process
Kuzman MK, Groselj P, Ayrilmis N, Zbasnik-Senegacnik M
Energy and Buildings, 64, 258, 2013 |
| 6 |
Sunflower seed cake as reinforcing filler in thermoplastic composites
Ayrilmis N, Kaymakci A, Ozdemir F
Journal of Applied Polymer Science, 129(3), 1170, 2013 |
| 7 |
Physical, mechanical, and thermal properties of polypropylene composites filled with walnut shell flour
Ayrilmis N, Kaymakci A, Ozdemir F
Journal of Industrial and Engineering Chemistry, 19(3), 908, 2013 |
| 8 |
Compression Wood as a Source of Reinforcing Filler for Thermoplastic Composites
Buyuksari U, Ayrilmis N, Akbulut T
Journal of Applied Polymer Science, 123(3), 1740, 2012 |
| 9 |
Properties of Flat-Pressed Wood Plastic Composites Containing Fire Retardants
Ayrilmis N, Benthien JT, Thoemen H, White RH
Journal of Applied Polymer Science, 122(5), 3201, 2011 |
| 10 |
Evaluation of the physical, mechanical properties and formaldehyde emission of particleboard manufactured from waste stone pine (Pinus pinea L.) cones
Buyuksari U, Ayrilmis N, Avci E, Koc E
Bioresource Technology, 101(1), 255, 2010 |
