검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Evaluation of Epoxy Underfill Materials for Solder Flip-Chip Technology Park CE, Han BJ, Bair HE, Raju VR Journal of Materials Science Letters, 16(12), 1027, 1997 |
| 2 |
Humidity Effects on Adhesion Strength Between Solder Ball and Epoxy Underfills Park CE, Han BJ, Bair HE Polymer, 38(15), 3811, 1997 |
| 3 |
Superconductivity and Cation-Vacancy Ordering in the Rare-Earth Fulleride Yb2.75C60 Ozdas E, Kortan AR, Kopylov N, Ramirez AP, Siegrist T, Rabe KM, Bair HE, Schuppler S, Citrin PH Nature, 375(6527), 126, 1995 |