검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Improving interfacial adhesion between copper foil and resin using amino acid in printed circuit board industry Luo L, Zhang ST, Qiang YJ, Bozdag I, Chen SJ, Tang MX, Gao JY, Qin ZJ Journal of Adhesion Science and Technology, 32(13), 1452, 2018 |