검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Microscopic analysis of the wood bond line using liquefied wood as adhesive Ugovsek A, Skapin AS, Humar M, Sernek M Journal of Adhesion Science and Technology, 27(11), 1247, 2013 |
| No. | Article |
|---|---|
| 1 |
Microscopic analysis of the wood bond line using liquefied wood as adhesive Ugovsek A, Skapin AS, Humar M, Sernek M Journal of Adhesion Science and Technology, 27(11), 1247, 2013 |