| 1 |
Atomic layer deposition of WNx thin films using a F-free tungsten metal-organic precursor and NH3 plasma as a Cu-diffusion barrier
Kim JB, Nandi DK, Kim TH, Jang Y, Bae JS, Hong TE, Kim SH
Thin Solid Films, 685, 393, 2019 |
| 2 |
Effect of deposition temperature on thermal stabilities of copper-carbon films in barrier-less Cu metallization
Zhu H, Fu ZQ, Xie Q, Yue W, Wang CB, Kang JJ, Lina Z
Applied Surface Science, 427, 276, 2018 |
| 3 |
Thin uniform nickel seed layer formation and its impact on Ni-Cu contact adhesion for c-Si solar cell applications
Bajpai VK, Pant P, Solanki CS
Solar Energy, 155, 62, 2017 |
| 4 |
N2O plasma treatment for minimization of background plating in silicon solar cells with Ni-Cu front side metallization
Raval MC, Saseendran SS, Suckow S, Saravanan S, Solanki CS, Kottantharayil A
Solar Energy Materials and Solar Cells, 144, 671, 2016 |
| 5 |
The effects of nitrogen incorporation on the properties of atomic layer deposited Ru thin films as a direct-plateable diffusion barrier for Cu interconnect
Mun KY, Hong TE, Cheon T, Jang YJ, Lim BY, Kim S, Kim SH
Thin Solid Films, 562, 118, 2014 |
| 6 |
Ultrathin Cr added Ru film as a seedless Cu diffusion barrier for advanced Cu interconnects
Hsu KC, Perng DC, Yeh JB, Wang YC
Applied Surface Science, 258(18), 7225, 2012 |
| 7 |
Surface treatment for Cu metallization on polyimide film by atmospheric pressure dielectric barrier discharge plasma system
Cho SJ, Shrestha SP, Boo JH
Current Applied Physics, 11(5), S135, 2011 |
| 8 |
Ta-Si-N박막의 조성에 따른 결정구조 및 구리 확산 방지 특성 연구
정병효, 이원종
Korean Journal of Materials Research, 21(2), 95, 2011 |
| 9 |
A novel two step metallization of Ni/Cu for low concentrator c-Si solar cells
Chaudhari VA, Solanki CS
Solar Energy Materials and Solar Cells, 94(12), 2094, 2010 |
| 10 |
A vacuum plasma surface pretreatment for refining seeding of Co in electroless copper plating
Chen ST, Huang CH, Chen GS
Thin Solid Films, 518(15), 4261, 2010 |
