화학공학소재연구정보센터
검색결과 : 51건
No. Article
1 Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling
Cale TS, Lu JQ, Gutmann RJ
Chemical Engineering Communications, 195(8), 847, 2008
2 Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration
Kwon Y, Jindal A, Augur R, Seok J, Cale TS, Gutmann RJ, Lu JQ
Journal of the Electrochemical Society, 155(5), H280, 2008
3 고온 열순환 공정이 BCB와 PECVD 산화규소막 계면의 본딩 결합력에 미치는 영향에 대한 연구
권용재, 석종원, Lu JQ, Cale TS, Gutmann RJ
Korean Chemical Engineering Research, 46(2), 389, 2008
4 Critical adhesion energy at the interface between benzocyclobutene and silicon nitride layers
Kwon Y, Seok J, Lu JQ, Cale TS, Gutmann RJ
Journal of the Electrochemical Society, 154(6), H460, 2007
5 Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration
Niklaus F, Kumar RJ, McMahon JJ, Yu J, Lu JQ, Cale TS, Gutmann RJ
Journal of the Electrochemical Society, 153(4), G291, 2006
6 Critical adhesion energy of benzocyclobutene-bonded wafers
Kwon Y, Seok J, Lu JQ, Cale TS, Gutmann RJ
Journal of the Electrochemical Society, 153(4), G347, 2006
7 Formation of body-centered-cubic tantalum via sputtering on low-kappa dielectrics at low temperatures
Senkevich JJ, Karabacak T, Bae DL, Cale TS
Journal of Vacuum Science & Technology B, 24(2), 534, 2006
8 Thermal cycling effects on critical adhesion energy and residual stress in benzocyclobutene-bonded wafers
Kwon Y, Seok J, Lu JQ, Cale TS, Gutmann RJ
Journal of the Electrochemical Society, 152(4), G286, 2005
9 Effects of substrate temperature on properties of pulsed dc reactively sputtered tantalum oxide films
Jain P, Juneja JS, Bhagwat V, Rymaszewski EJ, Lu TM, Cale TS
Journal of Vacuum Science & Technology A, 23(3), 512, 2005
10 Modeling pattern density dependent bump formation in copper electrochemical deposition
Im YH, Bloomfield MO, Sen S, Cale TS
Electrochemical and Solid State Letters, 6(3), C42, 2003