검색결과 : 51건
No. | Article |
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1 |
Three-dimensional integration in microelectronics: Motivation, processing, and thermomechanical modeling Cale TS, Lu JQ, Gutmann RJ Chemical Engineering Communications, 195(8), 847, 2008 |
2 |
Evaluation of BCB bonded and thinned wafer stacks for three-dimensional integration Kwon Y, Jindal A, Augur R, Seok J, Cale TS, Gutmann RJ, Lu JQ Journal of the Electrochemical Society, 155(5), H280, 2008 |
3 |
고온 열순환 공정이 BCB와 PECVD 산화규소막 계면의 본딩 결합력에 미치는 영향에 대한 연구 권용재, 석종원, Lu JQ, Cale TS, Gutmann RJ Korean Chemical Engineering Research, 46(2), 389, 2008 |
4 |
Critical adhesion energy at the interface between benzocyclobutene and silicon nitride layers Kwon Y, Seok J, Lu JQ, Cale TS, Gutmann RJ Journal of the Electrochemical Society, 154(6), H460, 2007 |
5 |
Adhesive wafer bonding using partially cured benzocyclobutene for three-dimensional integration Niklaus F, Kumar RJ, McMahon JJ, Yu J, Lu JQ, Cale TS, Gutmann RJ Journal of the Electrochemical Society, 153(4), G291, 2006 |
6 |
Critical adhesion energy of benzocyclobutene-bonded wafers Kwon Y, Seok J, Lu JQ, Cale TS, Gutmann RJ Journal of the Electrochemical Society, 153(4), G347, 2006 |
7 |
Formation of body-centered-cubic tantalum via sputtering on low-kappa dielectrics at low temperatures Senkevich JJ, Karabacak T, Bae DL, Cale TS Journal of Vacuum Science & Technology B, 24(2), 534, 2006 |
8 |
Thermal cycling effects on critical adhesion energy and residual stress in benzocyclobutene-bonded wafers Kwon Y, Seok J, Lu JQ, Cale TS, Gutmann RJ Journal of the Electrochemical Society, 152(4), G286, 2005 |
9 |
Effects of substrate temperature on properties of pulsed dc reactively sputtered tantalum oxide films Jain P, Juneja JS, Bhagwat V, Rymaszewski EJ, Lu TM, Cale TS Journal of Vacuum Science & Technology A, 23(3), 512, 2005 |
10 |
Modeling pattern density dependent bump formation in copper electrochemical deposition Im YH, Bloomfield MO, Sen S, Cale TS Electrochemical and Solid State Letters, 6(3), C42, 2003 |