검색결과 : 7건
| No. | Article |
|---|---|
| 1 |
Virtual integrated processing for integrated circuit manufacturing Chalupa R, Jiang L, Simka H, Shankar S, Thakurta D Journal of Vacuum Science & Technology A, 25(4), 1013, 2007 |
| 2 |
Electrochemical planarization of copper surfaces with submicron features Chalupa R, Andryushchenko T, Han J, Ghosh T, Shankar S, Fischer P Journal of Vacuum Science & Technology A, 25(4), 1019, 2007 |
| 3 |
Unsteady diffusion effects on electrodeposition into a submicron trench Chalupa R, Cao Y, West AC Journal of Applied Electrochemistry, 32(2), 135, 2002 |
| 4 |
High Schmidt mass transfer in a turbulent impinging slot-jet flow Chalupa R, Chen MY, Modi V, West AC International Journal of Heat and Mass Transfer, 44(20), 3775, 2001 |
| 5 |
Limiting current density on a line electrode in impinging slot-jet flows Chalupa R, Chen MY, Modi V, West AC Journal of the Electrochemical Society, 148(2), E92, 2001 |
| 6 |
Three-additive model of superfilling of copper Cao Y, Taephaisitphongse P, Chalupa R, West AC Journal of the Electrochemical Society, 148(7), C466, 2001 |
| 7 |
High Schmidt mass transfer in a laminar impinging slot jet flow Chen M, Chalupa R, West AC, Modi V International Journal of Heat and Mass Transfer, 43(21), 3907, 2000 |