1 |
Investigation of the suppression effect of polyethylene glycol on copper electroplating by electrochemical impedance spectroscopy Hung CC, Lee WH, Wang YL, Chan DY, Hwang GJ Journal of Vacuum Science & Technology A, 26(5), 1109, 2008 |
2 |
Investigation of deplating behavior of Pt contact pins in semiconductor Cu electroplating process Hu SY, Hung CC, Lee WH, Chang SC, Chan DY, Wang YL Thin Solid Films, 517(3), 1306, 2008 |
3 |
Electrophoretic Motion of 2 Spherical-Particles with Thick Double-Layers Shugai AA, Carnie SL, Chan DY, Anderson JL Journal of Colloid and Interface Science, 191(2), 357, 1997 |
4 |
2-D and 3-D Interactions in Random Sequential Adsorption of Charged-Particles Oberholzer MR, Stankovich JM, Carnie SL, Chan DY, Lenhoff AM Journal of Colloid and Interface Science, 194(1), 138, 1997 |
5 |
Rheooptical Studies of Polydiacetylene Solutions Gason SJ, Dunstan DE, Smith TA, Chan DY, White LR, Boger DV Journal of Physical Chemistry B, 101(39), 7732, 1997 |
6 |
Pair Interactions Between Heterogeneous Spheres Holt WJ, Chan DY Langmuir, 13(6), 1577, 1997 |
7 |
Direct Force Measurements Between Silica and Alumina Larson I, Drummond CJ, Chan DY, Grieser F Langmuir, 13(7), 2109, 1997 |
8 |
Use of Atomic-Force Microscopy Force Measurements to Monitor Citrate Displacement by Amines on Gold in Aqueous-Solution Larson I, Chan DY, Drummond CJ, Grieser F Langmuir, 13(9), 2429, 1997 |
9 |
Determination of the Intrinsic Acid-Base Dissociation-Constant and Site Density of Ionizable Surface Groups by Capillary Rise Measurements Chatelier RC, Hodges AM, Drummond CJ, Chan DY, Griesser HJ Langmuir, 13(11), 3043, 1997 |
10 |
Van-der-Waals-Interaction, Surface Free-Energies, and Contact Angles - Dispersive Polymers and Liquids Drummond CJ, Chan DY Langmuir, 13(14), 3890, 1997 |