화학공학소재연구정보센터
검색결과 : 4건
No. Article
1 Study of Interfacial Moisture Diffusion at Epoxy/Cu Interface
Chan EKL, Yuen MMF
Journal of Adhesion Science and Technology, 23(9), 1253, 2009
2 Investigation of moisture diffusion in electronic packages by molecular dynamics simulation
Fan HB, Chan EKL, Wong CKY, Yuen MMF
Journal of Adhesion Science and Technology, 20(16), 1937, 2006
3 Structure and characterization of the murine p80 coilin gene, Coil
Tucker KE, Massello LK, Gao LM, Barber TJ, Hebert MD, Chan EKL, Matera AG
Journal of Structural Biology, 129(2-3), 269, 2000
4 ASSOCIATION BETWEEN THE NUCLEOLUS AND THE COILED BODY
RASKA I, OCHS RL, ANDRADE LEC, CHAN EKL, BURLINGAME R, PEEBLES C, GRUOL D, TAN EM
Journal of Structural Biology, 104(1-3), 120, 1990