| 1 |
Rapid formation of tungsten oxide nanobundles with controllable morphology
Hsieh YT, Chen US, Hsueh SH, Huang MW, Shih HC
Applied Surface Science, 257(8), 3504, 2011 |
| 2 |
Rapid Synthesis of Bundled Tungsten Oxide Nanowires by Microwave Plasma-Enhanced Chemical Vapor Deposition and Their Optical Properties
Hsieh YT, Hsueh SH, Chen US, Huang MW, Shih HC
Journal of the Electrochemical Society, 157(9), K183, 2010 |
| 3 |
Growth and optical properties of uniform tungsten oxide nanowire bundles via a two-step heating process by thermal evaporation
Hsieh YT, Huang MW, Chang CC, Chen US, Shih HC
Thin Solid Films, 519(5), 1668, 2010 |
| 4 |
Modifying the properties of fluorinated amorphous films using argon by filtered cathodic vacuum arc
Lin YH, Syue YC, Lin HD, Chen US, Chang YS, Chen JR, Shih HC
Applied Surface Science, 255(5), 2139, 2008 |
| 5 |
Formation and cathodoluminescence of Al:ZnO nanoscrew clusters
Lin YH, Lin CC, Wu JM, Chen US, Chen JR, Shih HC
Thin Solid Films, 517(3), 1225, 2008 |
| 6 |
Size-controlled MoO3 nanoslabs synthesized by microwave plasma-enhanced chemical vapor deposition
Chang KP, Chen US, Shih HC
Electrochemical and Solid State Letters, 10(3), H111, 2007 |
| 7 |
Synthesis and characterization of self-catalyzed CuO nanorods on Cu/TaN/Si assembly using vacuum-arc Cu deposition and vapor-solid reaction
Chen US, Chueh YL, Lai SH, Chou LJ, Shih HC
Journal of Vacuum Science & Technology B, 24(1), 139, 2006 |
| 8 |
Characterization and formation of nanocrystalline diamonds in a-C/N films by filtered cathodic vacuum arc plasma
Hsieh WJ, Shih PS, Lin JH, Lin CC, Chen US, Huang SC, Chang YS, Shih HC
Thin Solid Films, 469-470, 120, 2004 |
| 9 |
Exploring metal vapor vacuum arc implanted copper to catalyze electroless-plated copper film on a TaN/FSG/Si assembly
Chen US, Lin JH, Hsieh WJ, Shih PS, Weng KW, Wang DY, Chang YS, Shih HC
Journal of Vacuum Science & Technology B, 21(3), 1129, 2003 |
| 10 |
Gap-filling capability and adhesion strength of the electroless-plated copper for submicron interconnect metallization
Lin JH, Hsieh WJ, Hsu JW, Liu XW, Chen US, Shih HC
Journal of Vacuum Science & Technology B, 20(2), 561, 2002 |
