검색결과 : 4건
| No. | Article |
|---|---|
| 1 |
Ultra-fine pitch chip-on-glass (COG) bonding with metal bumps having insulating layer in the side walls using anisotropic conductive film (ACF) Hong MH, Kim SC, Kim YH Current Applied Physics, 12(3), 612, 2012 |
| 2 |
Reliability of Fine-Pitch Flip-Chip (COG) Bonding with Non-Conductive Film Using Ultrasonic Energy Jo JL, Lee JB, Kim JM, Shin YE, Jung SB Journal of Adhesion, 86(5-6), 470, 2010 |
| 3 |
Effects of hygrothermal aging on anisotropic conductive adhesive joints: experiments and theoretical analysis Lin YC, Chen X, Wang ZP Journal of Adhesion Science and Technology, 20(12), 1383, 2006 |
| 4 |
Chip-on-glass bonding using sn bump and non-conductive adhesive for LCD application Kim BY, Chen ZG, Kim YH Molecular Crystals and Liquid Crystals, 458, 199, 2006 |