검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Improvement in Junction Breakdown and GIDL using MFLA in DRAM Product Lin SJ, Lai CS, Chen ST, Chan YJ, Chang RD, Wang WC, Huang B, Shih NT, Chuang G, Lee CY, Lee PI Journal of the Electrochemical Society, 158(4), H363, 2011 |
| 2 |
Oxidation of Ta diffusion barrier layer for Cu metallization in thermal annealing Yin KM, Chang L, Chen FR, Kai JJ, Chiang CC, Chuang G, Ding PJ, Chin B, Zhang H, Chen FS Thin Solid Films, 388(1-2), 27, 2001 |