검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Electroless Cu deposition on atomic layer deposited Ru as novel seed formation process in through-Si vias Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Leunissen P, Kondo M, Webb E, Shingubara S Electrochimica Acta, 100, 203, 2013 |
| 2 |
Electroless Copper Bath Stability Monitoring with UV-VIS Spectroscopy, pH, and Mixed Potential Measurements Inoue F, Philipsen H, Radisic A, Armini S, Civale Y, Shingubara S, Leunissen P Journal of the Electrochemical Society, 159(7), D437, 2012 |
| 3 |
Void-Free Filling of HAR TSVs Using a Wet Alkaline Cu Seed on CVD Co as a Replacement for PVD Cu Seed Armini S, El-Mekki Z, Vandersmissen K, Philipsen H, Rodet S, Honore M, Radisic A, Civale Y, Beyne E, Leunissen L Journal of the Electrochemical Society, 158(2), H160, 2011 |
| 4 |
Ultra-high aspect-ratio FinFET technology Jovanovic V, Suligoj T, Poljak M, Civale Y, Nanver LK Solid-State Electronics, 54(9), 870, 2010 |
| 5 |
Accurate SIMS doping profiling of aluminum-doped solid-phase epitaxy silicon islands Civale Y, Nanver LK, Alberici SG, Gammon A, Kelly I Electrochemical and Solid State Letters, 11(4), H74, 2008 |