화학공학소재연구정보센터
검색결과 : 6건
No. Article
1 Investigation of the curing behavior of a novel epoxy photo-dielectric dry film (ViaLux (TM) 81) for high density interconnect applications
Dunne RC, Sitaraman SK, Luo SJ, Rao Y, Wong CP, Estes WE, Gonzalez CG, Coburn JC, Periyasamy M
Journal of Applied Polymer Science, 78(2), 430, 2000
2 Dynamic-Mechanical and Dielectric-Relaxation in a Series of Main-Chain Thermotropic Liquid-Crystalline Polyesters
Avakian P, Coburn JC, Connolly MS, Sauer BB
Polymer, 37(17), 3843, 1996
3 Relaxation Behavior of Polyimides Based on 2,2’-Disubstituted Benzidines
Coburn JC, Soper PD, Auman BC
Macromolecules, 28(9), 3253, 1995
4 The Effect of Orientation on Thermal-Expansion Behavior in Polyimide Films
Pottiger MT, Coburn JC, Edman JR
Journal of Polymer Science Part B: Polymer Physics, 32(5), 825, 1994
5 Stress in Polyimide Coatings
Coburn JC, Pottiger MT, Noe SC, Senturia SD
Journal of Polymer Science Part B: Polymer Physics, 32(7), 1271, 1994
6 Structural Effects on the Transport of Water in Polyimides
Vanalsten JG, Coburn JC
Macromolecules, 27(14), 3746, 1994