검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Effects of copper seedlayer deposition method for electroplating Cooney EC, Strippe DC, Korejwa JW Journal of Vacuum Science & Technology A, 18(4), 1550, 2000 |
| 2 |
Effects of collimator aspects ratio and deposition temperature on copper sputtered seedlayers Cooney EC, Strippe DC, Korejwa JW, Simon AH, Uzoh C Journal of Vacuum Science & Technology A, 17(4), 1898, 1999 |