1 |
Evaluation of coating rate and adhesive force for copper deposition on the surface of polypropylene Fulazzaky MA, Fulazzaky M, Sumeru K Journal of Adhesion Science and Technology, 33(13), 1438, 2019 |
2 |
Direct Micropatterning of Initiator Layers for Surface-initiated ATRP: Spatially-regulated Growth of Polymer Brush and Subsequent Copper Electroless Plating Sato T, Urata C Molecular Crystals and Liquid Crystals, 688(1), 98, 2019 |
3 |
Electrochemical and stress characteristics of SiO/Cu/expanded graphite composite as anodes for lithium ion batteries Zhang JZ, Zhang J, Bao TZ, Xie XH, Xia BJ Journal of Power Sources, 348, 16, 2017 |
4 |
Patterning and formation of copper electroplated contact for bifacial silicon hetero-junction solar cell Yu J, Bian JT, Liu YC, Meng FY, Liu ZX Solar Energy, 146, 44, 2017 |
5 |
Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating Lv M, Liu JG, Wang SH, Ai J, Zeng XY Applied Surface Science, 366, 227, 2016 |
6 |
Electromagnetic shielding effectiveness and serviceability of the multilayer structured cuprammonium fabric/polypyrrole/copper (CF/PPy/Cu) composite Zhao H, Hou L, Lu YX Chemical Engineering Journal, 297, 170, 2016 |
7 |
Time Evolution of Stress and Microstructure in Electroplated Copper Films Sharma T, Shaver P, Brown DA, Bruning R, Peldzinski V, Ferro A Electrochimica Acta, 196, 479, 2016 |
8 |
Screen-printed masking of transparent conductive oxide layers for copper plating of silicon heterojunction cells Khanna A, Ritzau KU, Kamp M, Filipovic A, Schmiga C, Glatthaar M, Aberle AG, Mueller T Applied Surface Science, 349, 880, 2015 |
9 |
High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating Lv M, Liu JG, Zeng XY, Du QF, Ai J Applied Surface Science, 353, 1150, 2015 |
10 |
Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes Chang Y, Tao Y, Zhang Q, Yang ZG Electrochimica Acta, 158, 7, 2015 |