화학공학소재연구정보센터
검색결과 : 44건
No. Article
1 Evaluation of coating rate and adhesive force for copper deposition on the surface of polypropylene
Fulazzaky MA, Fulazzaky M, Sumeru K
Journal of Adhesion Science and Technology, 33(13), 1438, 2019
2 Direct Micropatterning of Initiator Layers for Surface-initiated ATRP: Spatially-regulated Growth of Polymer Brush and Subsequent Copper Electroless Plating
Sato T, Urata C
Molecular Crystals and Liquid Crystals, 688(1), 98, 2019
3 Electrochemical and stress characteristics of SiO/Cu/expanded graphite composite as anodes for lithium ion batteries
Zhang JZ, Zhang J, Bao TZ, Xie XH, Xia BJ
Journal of Power Sources, 348, 16, 2017
4 Patterning and formation of copper electroplated contact for bifacial silicon hetero-junction solar cell
Yu J, Bian JT, Liu YC, Meng FY, Liu ZX
Solar Energy, 146, 44, 2017
5 Higher-resolution selective metallization on alumina substrate by laser direct writing and electroless plating
Lv M, Liu JG, Wang SH, Ai J, Zeng XY
Applied Surface Science, 366, 227, 2016
6 Electromagnetic shielding effectiveness and serviceability of the multilayer structured cuprammonium fabric/polypyrrole/copper (CF/PPy/Cu) composite
Zhao H, Hou L, Lu YX
Chemical Engineering Journal, 297, 170, 2016
7 Time Evolution of Stress and Microstructure in Electroplated Copper Films
Sharma T, Shaver P, Brown DA, Bruning R, Peldzinski V, Ferro A
Electrochimica Acta, 196, 479, 2016
8 Screen-printed masking of transparent conductive oxide layers for copper plating of silicon heterojunction cells
Khanna A, Ritzau KU, Kamp M, Filipovic A, Schmiga C, Glatthaar M, Aberle AG, Mueller T
Applied Surface Science, 349, 880, 2015
9 High-adhesion Cu patterns fabricated by nanosecond laser modification and electroless copper plating
Lv M, Liu JG, Zeng XY, Du QF, Ai J
Applied Surface Science, 353, 1150, 2015
10 Selective adsorption of catalyst and copper plating for additive fabrication of conductive patterns and through-holes
Chang Y, Tao Y, Zhang Q, Yang ZG
Electrochimica Acta, 158, 7, 2015