검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Deposition of a Continuous and Conformal Copper Seed Layer by a Large-Area Electron Cyclotron Resonance Plasma Source with Embedded Lisitano Antenna Jang SO, You HJ, Kim YW, Jung YH, Hwang IU, Park JY, Lee H Plasma Chemistry and Plasma Processing, 34(1), 229, 2014 |
| 2 |
Atomic layer deposition of copper nitride film and its application to copper seed layer for electrodeposition Park JM, Jin K, Han B, Kim MJ, Jongwan JA, Kim JJ, Lee WJ Thin Solid Films, 556, 434, 2014 |
| 3 |
Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process Han WK, Hwang GH, Hong SJ, Yoon CS, Park JS, Cho JK, Kang SG Applied Surface Science, 255(12), 6082, 2009 |
| 4 |
Customized step coverage of copper seed layer using Eni-PVD (energetic neutral and ion physical vapor deposition) Lim ST, Park YC, Yoo SJ, Lee BJ Thin Solid Films, 517(14), 3935, 2009 |
| 5 |
갈바니 치환 증착 방법을 이용한 확산방지막 위에서의 구리 시드층 형성 김재정, 강무성 HWAHAK KONGHAK, 39(6), 721, 2001 |