| 1 |
Global proteome response of Synechocystis 6803 to extreme copper environments applied to control the activity of the inducible petJ promoter
Angeleri M, Muth-Pawlak D, Wilde A, Aro EM, Battchikova N
Journal of Applied Microbiology, 126(3), 826, 2019 |
| 2 |
Global proteome response of Synechocystis 6803 to extreme copper environments applied to control the activity of the inducible petJ promoter
Angeleri M, Muth-Pawlak D, Wilde A, Aro EM, Battchikova N
Journal of Applied Microbiology, 126(3), 826, 2019 |
| 3 |
Effect of graphene oxide on copper stress in Lemna minor L.: evaluating growth, biochemical responses, and nutrient uptake
Hu CW, Liu L, Li XL, Xu YD, Ge ZG, Zhao YJ
Journal of Hazardous Materials, 341, 168, 2018 |
| 4 |
Beneficial behavior of nitric oxide in copper-treated medicinal plants
Liu SL, Yang RJ, Pan YZ, Ren B, Chen QB, Li X, Xiong X, Tao JJ, Cheng QS, Ma MD
Journal of Hazardous Materials, 314, 140, 2016 |
| 5 |
Copper-induced hydrogen peroxide upregulation of a metallothionein gene, OsMT2c, from Oryza sativa L. confers copper tolerance in Arabidopsis thaliana
Liu J, Shi XT, Qian M, Zheng LQ, Lian CL, Xia Y, Shen ZG
Journal of Hazardous Materials, 294, 99, 2015 |
| 6 |
The role of microRNAs in copper and cadmium homeostasis
Ding YF, Zhu C
Biochemical and Biophysical Research Communications, 386(1), 6, 2009 |
| 7 |
Stress relaxation during isothermal annealing in electroplated Cu films
Hwang SJ, Joo YC, Koike J
Thin Solid Films, 516(21), 7588, 2008 |
| 8 |
Resistance characterization of Cu stress-induced void migration at narrow metal finger connected with wide lead
Wang RCJ, Chang-Liao KS, Wang TK, Lee CC, Lin JH, Oates AS, Lee SC, Wu K
Thin Solid Films, 516(2-4), 449, 2007 |
| 9 |
Texture evolution in Copper film at high temperature studied in situ by electron back-scatter diffraction
Mirpuri K, Wendrock H, Menzel S, Wetzig K, Szpunar J
Thin Solid Films, 496(2), 703, 2006 |
| 10 |
Evolution of stress-induced surface damage and stress-relaxation of electroplated Cu films at elevated temperatures
Hwang SJ, Koike J, Joo YC
Materials Science Forum, 475-479, 3641, 2005 |
