검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Effect of the deposition parameters on the voiding propensity of solder joints with Cu electroplated in a Hull cell Wafula F, Liu Y, Yin L, Borgesen P, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 41(4), 469, 2011 |
| 2 |
Impact of Key Deposition Parameters on the Voiding Sporadically Occurring in Solder Joints with Electroplated Copper Wafula F, Liu Y, Yin L, Bliznakov S, Borgesen P, Cotts EJ, Dimitrov N Journal of the Electrochemical Society, 157(2), D111, 2010 |
| 3 |
Influence of plating parameters and solution chemistry on the voiding propensity at electroplated copper-solder interface Liu Y, Wang J, Yin L, Kondos P, Parks C, Borgesen P, Henderson DW, Cotts EJ, Dimitrov N Journal of Applied Electrochemistry, 38(12), 1695, 2008 |
| 4 |
Enthalpy Increment Measurements from 4.5 K to 350 K and the Thermodynamic Properties of the Titanium Silicide Ti5Si3(Cr) Archer DG, Filer D, Oakley E, Cotts EJ Journal of Chemical and Engineering Data, 41(3), 571, 1996 |
| 5 |
Enthalpy Increment Measurements from 4.5 to 350 K and the Thermodynamic Properties of Titanium Disilicide(Cr) to 1700 K Archer DG, Sabella MS, Stillman SE, Cotts EJ Journal of Chemical and Engineering Data, 40(6), 1237, 1995 |