검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating Hai NTM, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P Electrochimica Acta, 83, 367, 2012 |
| No. | Article |
|---|---|
| 1 |
Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating Hai NTM, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P Electrochimica Acta, 83, 367, 2012 |