검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
NiSi 접촉과 Cu 플러그/Ti 확산방지층의 동시 형성 연구 배규식 Korean Journal of Materials Research, 20(6), 338, 2010 |
| 2 |
Post-etch residue removal in BCB/Cu interconnection structure Hong YT, Kim YI, Lee MC, Park S, Shim D, Park CM, Hong BY, Roh Y, Jung SH, Song IS Thin Solid Films, 435(1-2), 238, 2003 |
| 3 |
Ni/Cu metallization for low-cost high-efficiency PERC cells Lee EJ, Kim DS, Lee SH Solar Energy Materials and Solar Cells, 74(1-4), 65, 2002 |