검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
A failure criterion for debonding between encapsulants and leadframes in plastic IC packages Yi S, Shen LX, Kim JK, Yue CY Journal of Adhesion Science and Technology, 14(1), 93, 2000 |
| No. | Article |
|---|---|
| 1 |
A failure criterion for debonding between encapsulants and leadframes in plastic IC packages Yi S, Shen LX, Kim JK, Yue CY Journal of Adhesion Science and Technology, 14(1), 93, 2000 |