화학공학소재연구정보센터
검색결과 : 6건
No. Article
1 A 0.10 mu m buried p-channel MOSFET with through the gate boron implantation and arsenic tilted pocket
Guegan G, Deleonibus S, Caillat C, Tedesco S, Dal'zotto B, Heitzmann M, Nier ME, Mur P
Solid-State Electronics, 46(3), 343, 2002
2 A 20 nm physical gate length NMOSFET with a 1.2 nm gate oxide fabricated by mixed dry and wet hard mask etching
Caillat C, Deleonibus S, Guegan G, Heitzmann M, Nier ME, Tedesco S, Dal'zotto B, Martin F, Mur P, Papon AM, Lecarval G, Previtali B, Toffoli A, Allain F, Biswas S, Jourdan F, Fugier P, Dichiaro JL
Solid-State Electronics, 46(3), 349, 2002
3 Resolution limit of negative tone chemically amplified resist used for hybrid lithography: Influence of the molecular weight
Pain L, Higgins C, Scarfogliere B, Tedesco S, Dal'Zotto B, Gourgon C, Ribeiro M, Kusumoto T, Suetsugu M, Hanawa R
Journal of Vacuum Science & Technology B, 18(6), 3388, 2000
4 Measuring acid generation efficiency in chemically amplified resists with all three beams
Szmanda CR, Brainard RL, Mackevich JF, Awaji A, Tanaka T, Yamada Y, Bohland J, Tedesco S, Dal'Zotto B, Bruenger W, Torkler M, Fallmann W, Loeschner H, Kaesmaier R, Nealey PM, Pawloski AR
Journal of Vacuum Science & Technology B, 17(6), 3356, 1999
5 Resist processes for hybrid (electron-beam deep ultraviolet) lithography
Tedesco S, Mourier T, Dal'zotto B, McDougall A, Blanc-Coquant S, Quere Y, Paniez PJ, Mortini B
Journal of Vacuum Science & Technology B, 16(6), 3676, 1998
6 Specific behavior of chemically amplified systems with low activation energy under electron-beam exposure : Implementation of 248 and 193 nm resists
Mortini B, Tedesco S, Dal'Zotto B, Paniez P
Journal of Vacuum Science & Technology B, 15(6), 2534, 1997