검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Kinetic Monte Carlo simulation of three-dimensional shape evolution with void formation using Solid-by-Solid model: Application to via and trench filling Kaneko Y, Hiwatari Y, Ohara K, Asa F Electrochimica Acta, 100, 321, 2013 |
| 2 |
Electrochemical processing technologies in chip fabrication: challenges and opportunities Datta M Electrochimica Acta, 48(20-22), 2975, 2003 |