검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Effect of silicon nitride capping layer on via electromigration and failure criterion methodology in multilevel interconnection Huang JS, Deng XJ, Yih PH, Shofner TL, Obeng YS, Darling C Thin Solid Films, 397(1-2), 186, 2001 |