화학공학소재연구정보센터
검색결과 : 5건
No. Article
1 Reverse selectivity - High silicon nitride and low silicon dioxide removal rates using ceria abrasive-based dispersions
Dandu PRV, Devarapalli VK, Babu SV
Journal of Colloid and Interface Science, 347(2), 267, 2010
2 Selective removal of 10-40-nm particles from silicon wafers using laser-induced plasma shockwaves
Peri MDM, Devarapalli VK, Cetinkaya C
Journal of Adhesion Science and Technology, 21(3-4), 331, 2007
3 Synergistic roles of dodecyl sulfate and benzotriazole in enhancing the efficiency of CMP of copper
Hong Y, Devarapalli VK, Roy D, Babu SV
Journal of the Electrochemical Society, 154(6), H444, 2007
4 Particle removal with liquid-film-enhanced laser-induced plasma
Devarapalli VK, Peri MDM, Cetinkaya C
Journal of Adhesion Science and Technology, 20(2-3), 233, 2006
5 Post-chemical mechanical polishing cleaning of silicon wafers with laser-induced plasma
Devarapalli VK, Li Y, Cetinkaya C
Journal of Adhesion Science and Technology, 18(7), 779, 2004