| 1 |
Spontaneous Potential Oscillation Resulting in Copper Deposit with Ultra-Large Grains
Chan PF, Dow WP
Journal of the Electrochemical Society, 166(16), D891, 2019 |
| 2 |
Contrasts in Copper Deposition on Pt(111) Modified by 1-Mercaptopropionic and 1-Mercaptoacetic Acids as Probed by Voltammetry and STM
Yau S, Huang YT, Dow WP, Lee YL
Journal of the Electrochemical Society, 165(14), D761, 2018 |
| 3 |
Impurity Incorporation in the Cu Electrodeposit and Its Effects on the Microstructural Evolution of the Sn/Cu Solder Joints
Lee H, Yu TY, Cheng HK, Liu KC, Chan PF, Dow WP, Chen CM
Journal of the Electrochemical Society, 164(7), D457, 2017 |
| 4 |
Effects of Additives and Convection on Cu Foil Fabrication with a Low Surface Roughness
Chan PF, Ren RH, Wen SI, Chang HC, Dow WP
Journal of the Electrochemical Society, 164(9), D660, 2017 |
| 5 |
Interactive Effects of Additives and Electrolyte Flow Rate on the Microstructure of Electrodeposited Copper Foils
Lin CC, Yen CH, Lin SC, Hu CC, Dow WP
Journal of the Electrochemical Society, 164(13), D810, 2017 |
| 6 |
Direct Copper Pattern Plating on Glass and Ceramic Substrates Using an Al-Doped ZnO as an Adhesive and Conducting Layer
Cheng CW, Chan PF, Dow WP
Journal of the Electrochemical Society, 164(12), D687, 2017 |
| 7 |
Trap and release of bisphenol-A, 2-naphthol, and doxepin using a 1-hexadecylamine-copper(II)-amine functionalized indium-tin-oxide electrode
Lin GR, Biechele-Speziale J, Ernst E, Burris S, Conte ED, Dow WP, Lee RH, Suen SY
Chemical Engineering Journal, 295, 245, 2016 |
| 8 |
Electrodeposition of copper on an Au(111) electrode modified with mercaptoacetic acid in sulfuric acid
Lai CS, Hu XX, Yau S, Dow WP, Lee YL
Electrochimica Acta, 203, 272, 2016 |
| 9 |
Effects of Brighteners in a Copper Plating Bath on Throwing Power and Thermal Reliability of Plated Through Holes
Chen TC, Tsai YL, Hsu CF, Dow WP, Hashimoto Y
Electrochimica Acta, 212, 572, 2016 |
| 10 |
Effects of Cu Electroplating Formulas on the Interfacial Microstructures of Sn/Cu Joints
Yu TY, Lee H, Hsu HL, Dow WP, Cheng HK, Liu KC, Chen CM
Journal of the Electrochemical Society, 163(13), D734, 2016 |
