검색결과 : 5건
| No. | Article |
|---|---|
| 1 |
Measurement of adhesion strength in copper interconnection layers Hara T, Uchida M, Fujimoto M, Doy TK, Balakumar S, Babu N Electrochemical and Solid State Letters, 7(2), G28, 2004 |
| 2 |
Impact of novel pad groove designs on removal rate and uniformity of dielectric and copper CMP Doy TK, Seshimo K, Suzuki K, Philipossian A, Kinoshita M Journal of the Electrochemical Society, 151(3), G196, 2004 |
| 3 |
Characteristics of abrasive-free micelle slurry for copper CMP Matsuda T, Takahashi H, Tsurugaya M, Miyazaki K, Doy TK, Kinoshita M Journal of the Electrochemical Society, 150(9), G532, 2003 |
| 4 |
Mechanism of mechanical and chemical polishing in low dielectric constant plasma-enhanced chemical vapor deposition SiOC layer from hexamethyldisiloxane Hara T, Togoh F, Kurosu T, Sakamoto K, Shioya Y, Ishimaru T, Doy TK Electrochemical and Solid State Letters, 4(8), G65, 2001 |
| 5 |
Chemical mechanical polishing of polyarylether low dielectric constant layers by manganese oxide slurry Hara T, Tomisawa T, Kurosu T, Doy TK Journal of the Electrochemical Society, 146(6), 2333, 1999 |