| 1 |
The effect of organic additives for the prevention of copper electrochemical migration
Song SJ, Choi SR, Kim JG
Journal of Electroanalytical Chemistry, 832, 75, 2019 |
| 2 |
Surface failure analysis of a field-exposed copper-clad plate in a marine environment with industrial pollution
Yi P, Dong CF, Xiao K, Li XG
Applied Surface Science, 399, 608, 2017 |
| 3 |
Analysis of the Kinetics of Electrochemical Migration on Printed Circuit Boards Using Nernst-Planck Transport Equation
He XF, Azarian MH, Pecht MG
Electrochimica Acta, 142, 1, 2014 |
| 4 |
Mixing enhancement of low-Reynolds electro-osmotic flows in microchannels with temperature-patterned walls
Alizadeh A, Zhang L, Wang M
Journal of Colloid and Interface Science, 431, 50, 2014 |
| 5 |
Electrochemical migration, whisker formation, and corrosion behavior of printed circuit board under wet H2S environment
Zou SW, Li XG, Dong CF, Ding KK, Xiao K
Electrochimica Acta, 114, 363, 2013 |
| 6 |
Synthesis and Characterization of Polyurethane Acrylate Oligomers for Electrodes Protection Adhesives of Plasma Display Panel (PDP)
Hwang JS, Kim MH, Seo DS, Won JW, Moon DK, Kim DP
Molecular Crystals and Liquid Crystals, 514, 632, 2009 |
| 7 |
공정조성 SnPb Solder 합금의 부식 및 Electrochemical Migration 특성에 미치는 SO42- 이온의 영향
정자영, 유영란, 이신복, 김영식, 주영창, 박영배
Korean Journal of Materials Research, 17(1), 43, 2007 |
| 8 |
Electrochemical migration characteristics of eutectic SnPb solder alloy in printed circuit board
Lee SB, Yoo YR, Jung JY, Park YB, Kim YS, Joo YC
Thin Solid Films, 504(1-2), 294, 2006 |
