검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Electron backscatter diffraction characterization of blind hole fillings by electrolytic Cu deposition Ho CE, Hsu LH, Chen CC, Lu MK Thin Solid Films, 572, 232, 2014 |
| 2 |
Electron backscatter diffraction analysis on the microstructures of electrolytic Cu deposition in the through hole filling process Ho CE, Liao CW, Pan CX, Chen HJ, Kuo JC, Chen D Thin Solid Films, 544, 412, 2013 |