| 1 |
Failure mechanism of Ag-4Pd alloy wire bonded on Al-Si metallization under high temperature storage and thermal cycle tests in corrosive environments
Wang JN, Tsau YW, Ouyang FY
Materials Chemistry and Physics, 218, 147, 2018 |
| 2 |
Thermal and electrical properties of SiO2/SiC-epoxy composite by surface oxidation of silicon carbide
Mun SY, Cho KY, Lee D, Lim HM
Thermochimica Acta, 654, 70, 2017 |
| 3 |
Room-temperature electrical bonding technique based on copper/polystyrene core/shell nanowire surface fastener
Wang P, Ju Y, Chen MJ
Applied Surface Science, 349, 774, 2015 |
| 4 |
Magnetic nanoparticle-based solder composites for electronic packaging applications
Xu SY, Habib AH, Pickel AD, McHenry ME
PROGRESS IN MATERIALS SCIENCE, 67, 95, 2015 |
| 5 |
Thin film metallic glass as an underlayer for tin whisker mitigation: A room-temperature evaluation
Diyatmika W, Chu JP, Yen YW, Chang WZ, Hsueh CH
Thin Solid Films, 561, 93, 2014 |
| 6 |
Synthesis and surface characterization of silica nanoparticles from industrial resin waste controlled by optimal gelation conditions
Liou TH, Lin HS
Journal of Industrial and Engineering Chemistry, 18(4), 1428, 2012 |
| 7 |
A green route to preparation of MCM-41 silicas with well-ordered mesostructure controlled in acidic and alkaline environments
Liou TH
Chemical Engineering Journal, 171(3), 1458, 2011 |
| 8 |
Synergistic Toughening of Epoxy-Copper Interface Using a Thiol-Based Coupling Layer
Wong CKY, Leung SYY, Fan HB, Yuen MMF
Journal of Adhesion Science and Technology, 25(16), 2081, 2011 |
| 9 |
Role of Interface on Dynamic Modulus of High-Performance Poly(etheretherketone)/Ceramic Composites
Goyal RK, Tiwari AN, Negi YS
Journal of Applied Polymer Science, 121(1), 436, 2011 |
| 10 |
Mechanical Properties of Core-Shell Rubber (CSR)/Diallyl Phthalate (DAP)/Epoxy Systems for Electronic Packaging Materials
Jo Y, Choe Y
Molecular Crystals and Liquid Crystals, 539, 190, 2011 |
