검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Leveler Effect and Oscillatory Behavior during Copper Electroplating Huang Q, Baker-O'Neal BC, Parks C, Hopstaken M, Fluegel A, Emnet C, Arnold M, Mayer D Journal of the Electrochemical Society, 159(9), D526, 2012 |
| 2 |
Classification of suppressor additives based on synergistic and antagonistic ensemble effects Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D Electrochimica Acta, 56(13), 4724, 2011 |
| 3 |
Suppressor Effects during Copper Superfilling of Sub-100 nm Lines Huang Q, Baker-O'Neal BC, Kelly JJ, Broekmann P, Wirth A, Emnet C, Martin M, Hahn M, Wagner A, Mayer D Electrochemical and Solid State Letters, 12(4), D27, 2009 |