검색결과 : 2건
No. | Article |
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1 |
Electrodeposition of copper patterns using Enface technique under ultrasonic agitation Coleman S, Roy S Journal of Applied Electrochemistry, 45(8), 889, 2015 |
2 |
Effect of ultrasound on mass transfer during electrodeposition for electrodes separated by a narrow gap Coleman S, Roy S Chemical Engineering Science, 113, 35, 2014 |