| 1 |
결정성 바이페닐 에폭시 합성 및 경화 거동 연구
최봉구, 최호경, 최재현, 최중소
Korean Chemical Engineering Research, 58(1), 44, 2020 |
| 2 |
Investigation on curing characterization of epoxy molding compounds with different latent catalysts by thermal, electrical and mechanical analysis
Lee DE, Cho HJ, Kong BS, Choi HO
Thermochimica Acta, 674, 68, 2019 |
| 3 |
A molecular dynamics study of tensile strength between a highly-crosslinked epoxy molding compound and a copper substrate
Yang SR, Gao F, Qu JM
Polymer, 54(18), 5064, 2013 |
| 4 |
High thermal conductivity epoxy molding compound filled with a combustion synthesized AIN powder
Hsieh CY, Chung SL
Journal of Applied Polymer Science, 102(5), 4734, 2006 |
| 5 |
Dimple-type failures in a polymer/roughened metal system
Lee HY, Qu HM
Journal of Adhesion Science and Technology, 18(10), 1153, 2004 |
| 6 |
혼합 하중하에서의 고분자/거친금속 계면의 파손경로
이호영, 김성룡
Korean Journal of Materials Research, 14(5), 322, 2004 |
| 7 |
Plasma polymerization coating of silica fillers for Epoxy Molding Compounds (EMCs)
Lee JH, Roh JH, Yoon TH
Journal of Adhesion Science and Technology, 17(3), 383, 2003 |
| 8 |
Fracture toughness curves for epoxy molding compound/leadframe interfaces
Lee HY
Journal of Adhesion Science and Technology, 16(5), 565, 2002 |
| 9 |
Enhanced adhesion of silica for epoxy molding compounds (EMCs) by plasma polymer coatings
Roh JH, Lee JH, Yoon TH
Journal of Adhesion Science and Technology, 16(11), 1529, 2002 |
| 10 |
Effects of moisture on properties of epoxy molding compounds
Lu MG, Shim MJ, Kim SW
Journal of Applied Polymer Science, 81(9), 2253, 2001 |
