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| No. | Article |
|---|---|
| 1 |
Integrated Plasma-Promoted Chemical-Vapor-Deposition Route to Aluminum Interconnect and Plug Technologies for Emerging Computer Chip Metallization Faltermeier J, Knorr A, Talevi R, Gundlach H, Kumar KA, Peterson GG, Kaloyeros AE, Sullivan JJ, Loan J Journal of Vacuum Science & Technology B, 15(5), 1758, 1997 |