검색결과 : 1건
| No. | Article |
|---|---|
| 1 |
Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF) Lee JB, Koo JM, Kim JW, Noh BI, Lee JG, Jung SB Journal of Adhesion, 85(6), 341, 2009 |
| No. | Article |
|---|---|
| 1 |
Ultrasonic Bonding of Electrodes of Rigid and Flexible Printed Circuit Boards with Non-Conductive Film (NCF) Lee JB, Koo JM, Kim JW, Noh BI, Lee JG, Jung SB Journal of Adhesion, 85(6), 341, 2009 |