검색결과 : 8건
| No. | Article |
|---|---|
| 1 |
On the role of halides and thiols in additive-assisted copper electroplating Huynh TMT, Weiss F, Hai NTM, Reckien W, Bredow T, Fluegel A, Arnold M, Mayer D, Keller H, Broekmann P Electrochimica Acta, 89, 537, 2013 |
| 2 |
Polyvinylpyrrolidones (PVPs): Switchable Leveler Additives for Damascene Applications Hai NTM, Furrer J, Stricker F, Huynh TMT, Gjuroski I, Luedi N, Brunner T, Weiss F, Fluegel A, Arnold M, Chang I, Mayer D, Broekmann P Journal of the Electrochemical Society, 160(12), D3116, 2013 |
| 3 |
Competitive anion/anion interactions on copper surfaces relevant for Damascene electroplating Hai NTM, Huynh TTM, Fluegel A, Arnold M, Mayer D, Reckien W, Bredow T, Broekmann P Electrochimica Acta, 70, 286, 2012 |
| 4 |
Beyond interfacial anion/cation pairing: The role of Cu(I) coordination chemistry in additive-controlled copper plating Hai NTM, Kramer KW, Fluegel A, Arnold M, Mayer D, Broekmann P Electrochimica Acta, 83, 367, 2012 |
| 5 |
Leveler Effect and Oscillatory Behavior during Copper Electroplating Huang Q, Baker-O'Neal BC, Parks C, Hopstaken M, Fluegel A, Emnet C, Arnold M, Mayer D Journal of the Electrochemical Society, 159(9), D526, 2012 |
| 6 |
Classification of suppressor additives based on synergistic and antagonistic ensemble effects Broekmann P, Fluegel A, Emnet C, Arnold M, Roeger-Goepfert C, Wagner A, Hai NTM, Mayer D Electrochimica Acta, 56(13), 4724, 2011 |
| 7 |
Adsorption behavior of redox-active suppressor additives: Combined electrochemical and STM studies Hai NTM, Huynh TMT, Fluegel A, Mayer D, Broekmann P Electrochimica Acta, 56(21), 7361, 2011 |
| 8 |
Global model for calculating room-temperature glass density from the composition Fluegel A Journal of the American Ceramic Society, 90(8), 2622, 2007 |