화학공학소재연구정보센터
검색결과 : 6건
No. Article
1 Enhancement of semiconductor wafer cleaning by chelating agent addition
Gale GW, Rath DL, Cooper EI, Estes S, Okorn-Schmidt HF, Brigante J, Jagannathan R, Settembre G, Adams E
Journal of the Electrochemical Society, 148(9), G513, 2001
2 Dissolution kinetics for atomic, molecular, and ionic contamination from silicon wafers during aqueous processing
Suni II, Gale GW, Busnaina AA
Journal of the Electrochemical Society, 146(9), 3522, 1999
3 A visualization technique for surface flows
Gale GW, Busnaina AA, Zaazhoa MR
Chemical Engineering Communications, 165, 167, 1998
4 Removal of silica particles from silicon substrates using megasonic cleaning
Busnaina AA, Gale GW
Particulate Science and Technology, 15(3), 361, 1997
5 An Experimental-Study of Megasonic Cleaning of Silicon-Wafers
Busnaina AA, Kashkoush II, Gale GW
Journal of the Electrochemical Society, 142(8), 2812, 1995
6 Removal of particulate contaminants using ultrasonics and megasonics: A review
Gale GW, Busnaina AA
Particulate Science and Technology, 13(3), 197, 1995