1 |
Modeling current density distribution in electrochemical systems Georgiadou M Electrochimica Acta, 48(27), 4089, 2003 |
2 |
Modeling of transient electrochemical systems involving moving boundaries Georgiadou M, Veyret D Journal of the Electrochemical Society, 149(6), C324, 2002 |
3 |
Simulation of shape evolution during electrodeposition of copper in the presence of additive Georgiadou M, Veyret D, Sani RL, Alkire RC Journal of the Electrochemical Society, 148(1), C54, 2001 |
4 |
Local mass transport in two-dimensional cavities in laminar shear flow Georgiadou M, Mohr R, Alkire RC Journal of the Electrochemical Society, 147(8), 3021, 2000 |
5 |
Modelling of copper etching in aerated chloride solutions Georgiadou M, Alkire R Journal of Applied Electrochemistry, 28(2), 127, 1998 |
6 |
Finite-Difference Simulation of Multiion Electrochemical Systems Governed by Diffusion, Migration, and Convection - Implementation in Parallel-Plate Electrochemical Reactor and Backward-Facing Step Geometries Georgiadou M Journal of the Electrochemical Society, 144(8), 2732, 1997 |
7 |
Anisotropic Chemical-Pattern Etching of Copper Foil .3. Mathematical-Model Georgiadou M, Alkire R Journal of the Electrochemical Society, 141(3), 679, 1994 |