검색결과 : 3건
| No. | Article |
|---|---|
| 1 |
Communication-Ag NW Networks Enhanced by Ni Electroplating for Flexible Transparent Electrodes Wang S, Tian YH, Wang CX, Hang CJ Journal of the Electrochemical Society, 165(9), D328, 2018 |
| 2 |
Ultrasonic Bondability and Antioxidation Property of Ti/Cu/TaN/Ag Multi-layers on Si Substrate Hang CJ, Tian YH, Wang CQ, Wang N Thin Solid Films, 524, 224, 2012 |
| 3 |
Modeling of an oblique impact of solder droplet onto a groove with the impact point to be offset from the groove surfaces interface Tian D, Tian YH, Wang CQ, Hang CJ Journal of Materials Science, 44(7), 1772, 2009 |