화학공학소재연구정보센터
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No. Article
1 Band offsets in ITO/Ga2O3 heterostructures
Carey PH, Ren F, Hays DC, Gila BP, Pearton SJ, Jang S, Kuramata A
Applied Surface Science, 422, 179, 2017
2 High selectivity Inductively Coupled Plasma etching of GaAs over InGaP
Hays DC, Cho H, Lee JW, Devre MW, Reelfs BH, Johnson D, Sasserath JN, Meyer LC, Toussaint E, Ren F, Abernathy CR, Pearton SJ
Applied Surface Science, 156(1-4), 76, 2000
3 Surface morphology and removal rates for dry- and wet-etched novel resonator materials Part I. La3Ga5.5Ta0.5O14
Hays DC, Leerungnawarat P, Pearton SJ, Archibald G, Smythe RC
Applied Surface Science, 165(2-3), 127, 2000
4 Surface morphology and removal rates for dry- and wet-etched novel resonator materials - Part II. La3Ga5.5Nb0.5O14
Hays DC, Leerungnawarat P, Pearton SJ, Archibald G, Smythe RC
Applied Surface Science, 165(2-3), 135, 2000
5 Inductively coupled plasma etching in ICl- and IBr-based chemistries. Part I: GaAs, GaSb, and AlGaAs
Hahn YB, Hays DC, Cho H, Jung KB, Lambers ES, Abernathy CR, Pearton SJ, Hobson WS, Shul RJ
Plasma Chemistry and Plasma Processing, 20(3), 405, 2000
6 Inductively coupled plasma etching in ICl- and IBr-based chemistries. Part II: InP, InSb, InGaP, and InGaAs
Hahn YB, Hays DC, Cho H, Jung KB, Lambers ES, Abernathy CR, Pearton SJ, Hobson WS, Shul RJ
Plasma Chemistry and Plasma Processing, 20(3), 417, 2000
7 Comparison of Cl-2/He, Cl-2/Ar, and Cl-2/Xe plasma chemistries for dry etching of NiFe and NiFeCo
Jung KB, Cho H, Hahn YB, Hays DC, Lambers ES, Park YD, Feng T, Childress JR, Pearton SJ
Journal of the Electrochemical Society, 146(4), 1465, 1999
8 Comparison of F-2-based gases for high-rate dry etching of Si
Hays DC, Jung KB, Hahn YB, Lambers ES, Pearton SJ, Donahue J, Johnson D, Shul RJ
Journal of the Electrochemical Society, 146(10), 3812, 1999
9 Effect of additive noble gases in chlorine-based inductively coupled plasma etching of GaN, InN, and AlN
Hahn YB, Hays DC, Donovan SM, Abernathy CR, Han J, Shul RJ, Cho H, Jung KB, Pearton SJ
Journal of Vacuum Science & Technology A, 17(3), 768, 1999
10 Damage to III-V devices during electron cyclotron resonance chemical vapor deposition
Lee JW, Mackenzie KD, Johnson D, Hahn YB, Hays DC, Abernathy CR, Ren F, Pearton SJ
Journal of Vacuum Science & Technology A, 17(4), 2183, 1999