1 |
The effect of structural modifications on the solution and interfacial properties of straight and branched aliphatic alcohols: The role of hydrophobic effects Fong C, Greaves TL, Healy TW, Drummond CJ Journal of Colloid and Interface Science, 449, 364, 2015 |
2 |
The Oxide-Water Interface: How Valid Is the Site Dissociation-Surface Equilibria Model? Healy TW, Scales PJ Chemistry Letters, 41(10), 1020, 2012 |
3 |
Effect of the Degree of Dissociation of Molecules in a Monolayer at an Air/Water Interface on the Force Between the Monolayer and a Like-Charged Particle in the Subphase McNamee CE, Kappl M, Butt HJ, Nguyen H, Sato S, Graf K, Healy TW Journal of Physical Chemistry B, 116(46), 13731, 2012 |
4 |
The Electrokinetic Properties of Colloidal Magnetic Iron Oxides Metcalfe IM, Healy TW Langmuir, 28(20), 7897, 2012 |
5 |
zeta potential of nanoparticle suspensions: Effect of electrolyte concentration, particle size, and volume fraction Jailani S, Franks GV, Healy TW Journal of the American Ceramic Society, 91(4), 1141, 2008 |
6 |
The isoelectric point/point-of zero-charge of interfaces formed by aqueous solutions and nonpolar solids, liquids, and gases Healy TW, Fuerstenau DW Journal of Colloid and Interface Science, 309(1), 183, 2007 |
7 |
Electrical double layer interactions between dissimilar oxide surfaces with charge regulation and Stern-Grahame layers Chan DYC, Healy TW, Supasiti T, Usui S Journal of Colloid and Interface Science, 296(1), 150, 2006 |
8 |
Adsorption of organic matter at mineral/water interfaces. 6. Effect of inner-sphere versus outer-sphere adsorption on colloidal stability Johnson SB, Brown GE, Healy TW, Scales PJ Langmuir, 21(14), 6356, 2005 |
9 |
Special issue of the International Journal of Mineral Processing honoring Douglas W. Fuerstenau Healy TW, Han K, King P International Journal of Mineral Processing, 72(1-4), 1, 2003 |
10 |
The adsorption of alkyl and alkylbenzene sulfonates at mineral oxide-water interfaces Healy TW, Somasundaran P, Fuerstenau DW International Journal of Mineral Processing, 72(1-4), 3, 2003 |