화학공학소재연구정보센터
검색결과 : 15건
No. Article
1 A high growth rate atomic layer deposition process for nickel oxide film preparation using a combination of nickel(II) diketonate-diamine and ozone
Zhang YX, Du LY, Liu XF, Ding YQ
Applied Surface Science, 481, 138, 2019
2 Growth of aluminum nitride on flat and patterned Si (111) by high temperature halide CVD
Chubarov M, Mercier F, Lay S, Charlot F, Crisci A, Coindeau S, Encinas T, Ferro G, Reboud R, Boichot R
Thin Solid Films, 623, 65, 2017
3 Transparent and conducting intrinsic ZnO thin films prepared at high growth-rate with c-axis orientation and pyramidal surface texture
Mondal P, Das D
Applied Surface Science, 286, 397, 2013
4 Development of high density plasma assisted sputtering source for high growth rate deposition process
Kim DG, Lee S, Kim JK
Current Applied Physics, 11(5), S169, 2011
5 Solar cell of 6.3% efficiency employing high deposition rate (8 nm/s) microcrystalline silicon photovoltaic layer
Sobajima Y, Nishino M, Fukumori T, Kurihara M, Higuchi T, Nakano S, Toyama T, Okamoto H
Solar Energy Materials and Solar Cells, 93(6-7), 980, 2009
6 A simple tool for quality evaluation of the microcrystalline silicon prepared at high growth rate
Kocka J, Mates T, Ledinsky M, Stuchlikova H, Stuchlik J, Fejfar A
Thin Solid Films, 516(15), 4966, 2008
7 High growth rate (up to 20 mu m/h) SiC epitaxy in a horizontal hot-wall reactor
Zhang J, Mazzola J, Hoff C, Koshka Y, Casady J
Materials Science Forum, 483, 77, 2005
8 Improvement of ZnO TCO film growth for photovoltaic devices by reactive plasma deposition (RPD)
Iwata K, Sakemi T, Yamada A, Fons P, Awai K, Yamamoto T, Shirakata S, Matsubara K, Tampo H, Sakurai K, Ishizuka S, Niki S
Thin Solid Films, 480, 199, 2005
9 Homoepitaxial growth of cubic silicon carbide by sublimation epitaxy
Furusho T, Miyanagi T, Okui Y, Ohshima S, Nishino S
Materials Science Forum, 389-3, 279, 2002
10 Growth at high rates and characterization of bulk 3C-SiC material
Ferro G, Balloud C, Juillaguet S, Vicente P, Camassel J, Monteil Y
Materials Science Forum, 433-4, 115, 2002