검색결과 : 4건
No. | Article |
---|---|
1 |
Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias Josell D, Menk LA, Hollowell AE, Blain M, Moffat TP Journal of the Electrochemical Society, 166(1), D3254, 2019 |
2 |
Exploring the Limits of Bottom-Up Gold Filling to Fabricate Diffraction Gratings Josell D, Ambrozik S, Williams ME, Hollowell AE, Arrington C, Muramoto S, Moffat TP Journal of the Electrochemical Society, 166(16), D898, 2019 |
3 |
Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology Menk LA, Josell D, Moffat TP, Baca E, Blain MG, Smith A, Dominguez J, McClain J, Yeh PD, Hollowell AE Journal of the Electrochemical Society, 166(1), D3066, 2018 |
4 |
Galvanostatic Plating with a Single Additive Electrolyte for Bottom-Up Filling of Copper in Mesoscale TSVs Menk LA, Baca E, Blain MG, McClain J, Dominguez J, Smith A, Hollowell AE Journal of the Electrochemical Society, 166(1), D3226, 2018 |