| 1 |
Suppressing secondary reactions of coal pyrolysis by reducing pressure and mounting internals in fixed-bed reactor
Cheng S, Lai DG, Shi Z, Hong LS, Zhang JL, Zeng X, Gao SQ, Xu GW
Chinese Journal of Chemical Engineering, 25(4), 507, 2017 |
| 2 |
Fabrication of black silicon anti-reflection via nanocatalytic wet-chemical etch
Ho VTT, Giang BL, Hong LS, Nguyen NG
Molecular Crystals and Liquid Crystals, 644(1), 169, 2017 |
| 3 |
Effect of Gallium Source Material on the Transparent Conducting Properties of Ga:ZnO Thin Films Through Metalorganic Chemical Vapor Deposition
Ho VTT, Bach LG, Thanh T, Nguyen GG, Hong LS
Molecular Crystals and Liquid Crystals, 623(1), 433, 2015 |
| 4 |
Growth of Vertically-Aligned GaN Nanowires by Metal Organic Chemical Vapor Deposition Utilizing Trimethygallium and Tertiarybutylhydrazine
Ho VTT, Bach LG, Thanh T, Nguyen NG, Hong LS
Molecular Crystals and Liquid Crystals, 623(1), 444, 2015 |
| 5 |
Mechanism of growth of the ge wetting layer upon exposure of Si(100)-2 x 1 to GeH4
Liu CS, Chou LW, Hong LS, Jiang JC
Journal of the American Chemical Society, 130(16), 5440, 2008 |
| 6 |
Sharp infrared emission from single-crystalline indium nitride nanobelts prepared using guided-stream thermal chemical vapor deposition
Hu MS, Wang WM, Chen TT, Hong LS, Chen CW, Chen CC, Chen YF, Chen KH, Chen LC
Advanced Functional Materials, 16(4), 537, 2006 |
| 7 |
Zinc oxide doped indium oxide ohmic contacts to p-type GaN
Chen LC, Chen CM, Liu CS, Hong LS
Journal of the Electrochemical Society, 153(11), G931, 2006 |
| 8 |
Photosensitive gold-nanoparticle-embedded dielectric nanowires
Hu MS, Chen HL, Shen CH, Hong LS, Huang BR, Chen KH, Chen LC
Nature Materials, 5(2), 102, 2006 |
| 9 |
Quantum chemical study on the gas-phase reaction of tertiarybutylhydrazine: A potential nitrogen-bearing compound for GaN film growth
Hsu YJ, Hong LS, Jiang JC
Thin Solid Films, 498(1-2), 100, 2006 |
| 10 |
Initial growth of chemical-vapor-deposited Ru from bis(hexafluoroacetylacetonate)dicarbonyl ruthenium
Cheng WY, Hong LS, Jiang JC, Chi Y, Lin CC
Thin Solid Films, 483(1-2), 31, 2005 |
