검색결과 : 2건
| No. | Article |
|---|---|
| 1 |
Ta and Ta-N diffusion barriers sputtered with various N-2/Ar ratios for Cu metallization Wang JH, Chen LJ, Lu ZC, Hsiung CS, Hsieh WY, Yew TR Journal of Vacuum Science & Technology B, 20(4), 1522, 2002 |
| 2 |
Effects of a new combination of additives in electroplating solution on the properties of Cu films in ULSI applications Hu JC, Chang TC, Wu CW, Chen LJ, Hsiung CS, Hsieh WY, Lur W, Yew TR Journal of Vacuum Science & Technology A, 18(4), 1207, 2000 |