화학공학소재연구정보센터
검색결과 : 8건
No. Article
1 GAPDH inhibits intracellular pathways during starvation for cellular energy homeostasis
Yang JS, Hsu JW, Park SY, Li J, Oldham WM, Beznoussenko GV, Mironov AA, Loscalzo J, Hsu VW
Nature, 561(7722), 263, 2018
2 The etching behavior of n-GaP in aqua regia solutions
Chang KL, Lee CK, Hsu JW, Hsieh HF, Shih HC
Journal of Applied Electrochemistry, 35(1), 77, 2005
3 An engineering approach to predict the polishing rate in CMP with rotational equipment
Chen PH, Shih HC, Huang BW, Hsu JW
Journal of the Electrochemical Society, 151(10), G649, 2004
4 Catalytic-pad chemical kinetics model of CMP
Chen PH, Shih HC, Huang BW, Hsu JW
Electrochemical and Solid State Letters, 6(12), G140, 2003
5 The removal selectivity of titanium and aluminum in chemical mechanical planarization
Hsu JW, Chiu SY, Wang YL, Dai BT, Tsai MS, Feng MS, Shih HC
Journal of the Electrochemical Society, 149(3), G204, 2002
6 Gap-filling capability and adhesion strength of the electroless-plated copper for submicron interconnect metallization
Lin JH, Hsieh WJ, Hsu JW, Liu XW, Chen US, Shih HC
Journal of Vacuum Science & Technology B, 20(2), 561, 2002
7 Electrochemical behavior of copper chemical mechanical polishing in KIO3 slurry
Hsu JW, Chiu SY, Tsai MS, Dai BT, Feng MS, Shih HC
Journal of Vacuum Science & Technology B, 20(2), 608, 2002
8 The phase identification of H2SO4-etched InP by X-ray diffraction
Liu HC, Tsai SH, Hsu JW, Shih HC
Journal of the Electrochemical Society, 146(9), 3510, 1999